Photonic chips, which utilize light instead of electrical signals for data transmission, are transforming AI processing by offering unprecedented speed and energy efficiency. A notable development is TDK's "spin photo detector," which achieves response times of just 20 picoseconds, surpassing traditional semiconductor-based detectors. This innovation addresses the data transfer bottleneck in AI systems, potentially revolutionizing the AI and data center industries. ft.com
Similarly, researchers at Columbia Engineering have developed a 3D photonic-electronic platform that integrates photonics with advanced CMOS electronics. This platform delivers high bandwidth (800 Gb/s) with exceptional energy efficiency, consuming just 120 femtojoules per bit. By 3D integrating photonic and electronic chips, this technology enables efficient data transfer, supporting distributed AI architectures previously limited by energy and latency constraints. engineering.columbia.edu